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1 Ergebnisse
1
An Intensive Study of Effects of Orientations of Cu Bumps o..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Zheng, Deng-Wu
;
Zhou, Min-Bo
;
Liu, Shuai
.. - p. 1760-1766 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00301
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>An Intensive Study of Effects of Orientations of Cu Bumps on Cu-Cu Direct Bonding for 3D Integration by Molecular Dynamics Simulation</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195609&Exemplar=1&LAN=DE A1 Zheng, Deng-Wu A1 Zhou, Min-Bo A1 Liu, Shuai A1 Ke, Chang-Bo A1 Zhang, Xin-Ping YR 2023 SN 2377-5726 K1 Temperature sensors K1 Solid modeling K1 Three-dimensional displays K1 Electronic components K1 Crystals K1 Bonding K1 Stress K1 3D integration K1 chip stacking K1 micro Cu bump K1 Cu-Cu direct bonding K1 crystal orientation K1 molecular dynamics SP 1760 OP 1766 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00301 DO https://doi.org/10.1109/ECTC51909.2023.00301 SF ELIB - SuUB Bremen
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