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1 Ergebnisse
1
Reliability Investigations of Polymer Based Redistribution ..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Kwak, Ji-Youn
;
Chery, Emmanuel
;
Bertheau, Julien
... - p. 1080-1084 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00184
RT T1
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
: T1
Reliability Investigations of Polymer Based Redistribution Layers (RDL) Protected by a Mold Layer
UL https://suche.suub.uni-bremen.de/peid=ieee-10195613&Exemplar=1&LAN=DE A1 Kwak, Ji-Youn A1 Chery, Emmanuel A1 Bertheau, Julien A1 Slabbekoorn, John A1 De Messemaeker, Joke A1 Beyne, Eric YR 2023 SN 2377-5726 K1 High-temperature superconductors K1 Liquids K1 Three-dimensional displays K1 Moisture K1 Materials reliability K1 Oxidation K1 Copper K1 3D packaging K1 Reliability K1 Redistribution layers (RDL) K1 Copper oxidation K1 Mold layer K1 Photosensitive polymer SP 1080 OP 1084 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00184 DO https://doi.org/10.1109/ECTC51909.2023.00184 SF ELIB - SuUB Bremen
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