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1 Ergebnisse
1
Integrating Chiplets using Chips First Ultra-High-Density F..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Jose, Benedict San
;
Sandstrom, Cliff
;
Talain, Erick
... - p. 271-276 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00053
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Integrating Chiplets using Chips First Ultra-High-Density Fan-out with Maskless Laser Direct Imaging and Adaptive Patterning for High Performance Computing</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195614&Exemplar=1&LAN=DE A1 Jose, Benedict San A1 Sandstrom, Cliff A1 Talain, Erick A1 Kellar, Jan A1 Olson, Tim A1 Melgo, Mary Maye A1 Gacho, Rizi A1 Kim, BC YR 2023 SN 2377-5726 K1 Performance evaluation K1 Industries K1 Program processors K1 Semiconductor devices K1 Lithography K1 Lasers K1 Imaging K1 Fan-out Wafer Level Packaging K1 M-Series K1 Adaptive Pattering K1 Ultra High-Density Interconnect SP 271 OP 276 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00053 DO https://doi.org/10.1109/ECTC51909.2023.00053 SF ELIB - SuUB Bremen
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