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1 Ergebnisse
1
Thermal Characterization of 3-D Stacked Heterogeneous Integ..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Jain, Aakrati
;
Miyazawa, Risa
;
Raghavan, Sathya
... - p. 1219-1225 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00208
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Thermal Characterization of 3-D Stacked Heterogeneous Integration (HI) Package for High-Power Computing Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195618&Exemplar=1&LAN=DE A1 Jain, Aakrati A1 Miyazawa, Risa A1 Raghavan, Sathya A1 Chowdhury, Prabudhya Roy A1 Farooq, Mukta Ghate A1 Kumar, Arvind A1 Sakuma, Katsuyuki YR 2023 SN 2377-5726 K1 Cooling K1 Computational modeling K1 Thermal resistance K1 Stacking K1 Multichip modules K1 Electronic packaging thermal management K1 Boundary conditions K1 thermal characterization K1 Heterogeneous Integration K1 3-D stacking K1 high-power computing K1 cooling SP 1219 OP 1225 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00208 DO https://doi.org/10.1109/ECTC51909.2023.00208 SF ELIB - SuUB Bremen
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