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1 Ergebnisse
1
Heterogeneous Integration of Diamond Heat Spreaders for Pow..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Martin, Henry
;
Reintjes, Marcia
;
Reijs, Dave
... - p. 118-125 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00029
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Heterogeneous Integration of Diamond Heat Spreaders for Power Electronics Application</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195627&Exemplar=1&LAN=DE A1 Martin, Henry A1 Reintjes, Marcia A1 Reijs, Dave A1 Dorrestein, Sander A1 Kengen, Martien A1 Libon, Sebastien A1 Smits, Edsger A1 Tang, Xiao A1 Koelink, Marco A1 Poelma, Rene A1 van Driel, Willem A1 Zhang, GuoQi YR 2023 SN 2377-5726 K1 Heating systems K1 Temperature measurement K1 Performance evaluation K1 Degradation K1 Diamonds K1 Electronic packaging thermal management K1 Junctions K1 Advanced thermal solutions K1 Advanced packaging K1 CVD Diamonds K1 Thermal Test Chips SP 118 OP 125 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00029 DO https://doi.org/10.1109/ECTC51909.2023.00029 SF ELIB - SuUB Bremen
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