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1 Ergebnisse
1
Effects of Twin Boundary and Precipitates on Board Level Re..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Yoon, Dal-Jin
;
Lee, Byoungdo
;
Kim, Jihye
... - p. 1091-1094 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00186
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Effects of Twin Boundary and Precipitates on Board Level Reliability in Sn-Ag-Cu(SAC) Solder Joints through EBSD Analysis</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195633&Exemplar=1&LAN=DE A1 Yoon, Dal-Jin A1 Lee, Byoungdo A1 Kim, Jihye A1 Hyun, Sungho A1 Lee, Gyujei A1 Lee, Kangwook YR 2023 SN 2377-5726 K1 Additives K1 Electron backscatter diffraction K1 Failure analysis K1 Electronic components K1 Nickel K1 Reliability K1 Microstructure K1 solder joint K1 twin K1 precipitate K1 board level reliability SP 1091 OP 1094 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00186 DO https://doi.org/10.1109/ECTC51909.2023.00186 SF ELIB - SuUB Bremen
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