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TSV-based Stacked Silicon Capacitor with Embedded Package P..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Hwang, Kyojin ; Hwang, Jisoo ; Jung, Woobin... - p. 1359-1363 , 2023
Link: https://doi.org/10.1109/ECTC51909.2023.00232