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Chip-to-Chip Hybrid Bonding with Larger-Oriented Cu Grains ..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Murugesan, M. ; Sawa, M. ; Sone, E.... - p. 1713-1718 , 2023
Link: https://doi.org/10.1109/ECTC51909.2023.00292