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1 Ergebnisse
1
Electromigration Performance of Fine-Line Cu Redistribution..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Kwon, JiHye
;
Ju, JeongMin
;
Kim, SangHyuk
.. - p. 1297-1302 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00221
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Electromigration Performance of Fine-Line Cu Redistribution Layer (RDL) for High-Density Fan-Out Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195655&Exemplar=1&LAN=DE A1 Kwon, JiHye A1 Ju, JeongMin A1 Kim, SangHyuk A1 Sohn, EunSook A1 Khim, JinYoung YR 2023 SN 2377-5726 K1 Electromigration K1 Resistance K1 Degradation K1 Temperature K1 Packaging K1 Behavioral sciences K1 Current density K1 Redistribution layer (RDL) K1 HDFO (High-Density Fan-Out) SP 1297 OP 1302 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00221 DO https://doi.org/10.1109/ECTC51909.2023.00221 SF ELIB - SuUB Bremen
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