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1 Ergebnisse
1
Creative Design and Structure Applied to Chiplets Packaging:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Wang, Chen-Chao
;
Huang, Chih-Yi
;
Kuo, Hung-Chun
... - p. 1353-1358 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00231
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Creative Design and Structure Applied to Chiplets Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195660&Exemplar=1&LAN=DE A1 Wang, Chen-Chao A1 Huang, Chih-Yi A1 Kuo, Hung-Chun A1 Jhong, Ming-Fong A1 Chu, Fu-Chen A1 Lai, Chung-Hung A1 Huang, Hung-Hsien A1 Hung, Chih-Pin YR 2023 SN 2377-5726 K1 Integrated circuits K1 Semiconductor device modeling K1 Costs K1 Multichip modules K1 Stars K1 Bandwidth K1 Silicon K1 Chiplets K1 advance packaging K1 heterogeneous integration SP 1353 OP 1358 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00231 DO https://doi.org/10.1109/ECTC51909.2023.00231 SF ELIB - SuUB Bremen
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