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Ultra High Density Low Temperature SoIC with Sub-0.5 μm Bon..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Chia, Han-Jong ; Tai, Shih-Peng ; Cui, Ji James... - p. 1-4 , 2023
Link: https://doi.org/10.1109/ECTC51909.2023.00008