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1 Ergebnisse
1
Simulation-Assisted Board Level Solder Joint Reliability Op..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Ahmed, Omar
;
Shukla, Vishnu
;
Hutchinson, Leif
... - p. 1303-1308 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00222
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Simulation-Assisted Board Level Solder Joint Reliability Optimization for Large 80mm+ 2.5D Devices</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195667&Exemplar=1&LAN=DE A1 Ahmed, Omar A1 Shukla, Vishnu A1 Hutchinson, Leif A1 Su, Peng A1 Glasauer, Bernard A1 Jiang, Tengfei YR 2023 SN 2377-5726 K1 Temperature measurement K1 Performance evaluation K1 Semiconductor device measurement K1 Fatigue K1 Reliability engineering K1 Numerical simulation K1 Microstructure K1 Board-level Reliability K1 Simulation K1 SAC305 K1 Thermal Solutions SP 1303 OP 1308 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00222 DO https://doi.org/10.1109/ECTC51909.2023.00222 SF ELIB - SuUB Bremen
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