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1 Ergebnisse
1
Application of Nickel Micro-Plating Bonding (NMPB) Technolo..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Yu, Xinguang
;
Kasahara, Junichi
;
Hashimoto, Kimikazu
... - p. 1719-1724 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00293
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Application of Nickel Micro-Plating Bonding (NMPB) Technology to Crystalline Silicon Solar Cell Interconnection</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195677&Exemplar=1&LAN=DE A1 Yu, Xinguang A1 Kasahara, Junichi A1 Hashimoto, Kimikazu A1 Morisako, Isamu A1 Shimmi, Toshiharu A1 Mikami, Nobuhiro A1 Tatsumi, Kohei YR 2023 SN 2377-5726 K1 Resistance K1 Photovoltaic cells K1 Wires K1 Lead K1 Silicon K1 Nickel K1 Reliability K1 nickel K1 micro-plating K1 interconnection K1 crystalline silicon K1 solar cell K1 reliability K1 PV module SP 1719 OP 1724 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00293 DO https://doi.org/10.1109/ECTC51909.2023.00293 SF ELIB - SuUB Bremen
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