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1 Ergebnisse
1
Investigation on Fatigue Life of Non-Symmetric Solder Joint..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Ha, Jonghwan
;
Yang, Junbo
;
Yin, Pengcheng
... - p. 840-845 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00145
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Investigation on Fatigue Life of Non-Symmetric Solder Joints in Chip Resistors</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195685&Exemplar=1&LAN=DE A1 Ha, Jonghwan A1 Yang, Junbo A1 Yin, Pengcheng A1 Deo, Karthic Arun A1 Cai, Chongyang A1 Park, Seungbae YR 2023 SN 2377-5726 K1 Resistors K1 Shape K1 Thermal resistance K1 Electric shock K1 Loading K1 Thermal shock K1 Fatigue K1 chip resistor K1 fatigue life K1 overhang K1 solder shape K1 thermal shock cycle SP 840 OP 845 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00145 DO https://doi.org/10.1109/ECTC51909.2023.00145 SF ELIB - SuUB Bremen
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