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Demonstration of a Wafer Level Face- To-Back (F2B) Fine Pit..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Suarez Berru, Jerzy Javier ; Nicolas, Stephane ; Bresson, Nicolas.. - p. 97-102 , 2023
Link: https://doi.org/10.1109/ECTC51909.2023.00025