I agree that this site is using cookies. You can find further informations here.
X
Merkliste 
 1 Ergebnisse 
 
1

Assembly Challenges and Approaches for 2.5D Chiplet Based S..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Lim, Sharon PeiSiang ; Rotaru, Mihai D. ; Seit, Wenwei. - p. 132-138 , 2023
Link: https://doi.org/10.1109/ECTC51909.2023.00031