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1 Ergebnisse
1
C2W Hybrid Bonding Interconnect Technology for Higher Densi..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Kim, Kibum
;
Lim, Sanghyuk
;
Jung, Dongwook
... - p. 1048-1052 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00179
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>C2W Hybrid Bonding Interconnect Technology for Higher Density and Better Thermal Dissipation of High Bandwidth Memory</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195713&Exemplar=1&LAN=DE A1 Kim, Kibum A1 Lim, Sanghyuk A1 Jung, Dongwook A1 Choi, Jeongyun A1 Na, Song. A1 Yeom, Jaehvun. A1 Lee, Miseon A1 Kim, Jongyeon A1 Kwon, Jongoh A1 Moon, Ki-Il A1 Lee, Gyuje A1 Lee, Kangwook YR 2023 SN 2377-5726 K1 Annealing K1 Thermal resistance K1 Stacking K1 Semiconductor device reliability K1 Process control K1 Bandwidth K1 Electronic packaging thermal management K1 Hybrid bonding K1 Chip to Wafer Bonding K1 High Bandwidth Memory K1 Thermal Resistivity SP 1048 OP 1052 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00179 DO https://doi.org/10.1109/ECTC51909.2023.00179 SF ELIB - SuUB Bremen
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