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1 Ergebnisse
1
Advanced Packaging Design Platform for Chiplets and Heterog..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Cao, Lihong
;
Wang, Chen-Chao
;
Huang, Chih-Yi
. - p. 1032-1037 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00176
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Advanced Packaging Design Platform for Chiplets and Heterogeneous Integration</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195715&Exemplar=1&LAN=DE A1 Cao, Lihong A1 Wang, Chen-Chao A1 Huang, Chih-Yi A1 Kou, Hung-Chun YR 2023 SN 2377-5726 K1 Process design K1 Three-dimensional displays K1 Multichip modules K1 Silicon K1 Pins K1 Manufacturing K1 Through-silicon vias K1 Chiplets integration K1 Chip-to-package hybrid design platform K1 Fanout RDL organic interposer K1 2.5D Si TSV interposer K1 FOCoS (Fanout Chip on Substrate) K1 UCIe SP 1032 OP 1037 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00176 DO https://doi.org/10.1109/ECTC51909.2023.00176 SF ELIB - SuUB Bremen
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