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Characterization of Packaging, Electronic, and Photonic Mat..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Lewis, Christopher J. ; Marchio, Jacob D. ; Sellers, Drew. - p. 2230-2234 , 2023
Link: https://doi.org/10.1109/ECTC51909.2023.00386