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1 Ergebnisse
1
6-Sided Die Protection for Chiplet Package with Multi-Layer..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Kim, Byung-Cheol
;
Melgo, Mary Maye
;
Gacho, Rizi
... - p. 1566-1570 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00266
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>6-Sided Die Protection for Chiplet Package with Multi-Layer RDL</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195722&Exemplar=1&LAN=DE A1 Kim, Byung-Cheol A1 Melgo, Mary Maye A1 Gacho, Rizi A1 Oh, Kwang-Sun A1 Lim, Jacinta Aman A1 Sandstrom, Cliff YR 2023 SN 2377-5726 K1 Materials reliability K1 Semiconductor device manufacture K1 Routing K1 Silicon K1 Robustness K1 Object recognition K1 Polymers K1 300mm FOWLP K1 Fan-Out 600mm FOPLP K1 Chiplets K1 Multi-layer RDL K1 2um L/S SP 1566 OP 1570 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00266 DO https://doi.org/10.1109/ECTC51909.2023.00266 SF ELIB - SuUB Bremen
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