I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Optimization of 2.2D Underfill Process by Novel Methodology..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Sun, Chia-Peng
;
Liang, Yu-En
;
Hu, Dyi-Chung
... - p. 175-180 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00038
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Optimization of 2.2D Underfill Process by Novel Methodology and Direct Observation of Capillary Underfill Process</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195726&Exemplar=1&LAN=DE A1 Sun, Chia-Peng A1 Liang, Yu-En A1 Hu, Dyi-Chung A1 Chen, Er-Hao A1 Lee, Jeffrey ChangBing A1 Vallury, Srikar YR 2023 SN 2377-5726 K1 Productivity K1 Encapsulation K1 Solid modeling K1 Costs K1 Three-dimensional displays K1 Electronic components K1 Predictive models K1 capillary underfill K1 underfill dispensing K1 filling time K1 process optimization K1 multi-chip package K1 micro bumps K1 3D CAE modeling K1 Equivalent Bump Group (EBG) model K1 heterogeneous integration K1 real-time observation K1 2.2D K1 chiplets SP 175 OP 180 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00038 DO https://doi.org/10.1109/ECTC51909.2023.00038 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)
