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1 Ergebnisse
1
A Novel Chiplet Integration Architecture Employing Pillar-S..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Morikawa, Yasuhiro
;
Koh, Meiten
;
Hashimoto, Hiroyuki
... - p. 34-39 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00014
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A Novel Chiplet Integration Architecture Employing Pillar-Suspended Bridge with Polymer Fine-Via Interconnect</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195732&Exemplar=1&LAN=DE A1 Morikawa, Yasuhiro A1 Koh, Meiten A1 Hashimoto, Hiroyuki A1 Chen, Chuantong A1 Wang, Ye A1 Kono, Ichiro A1 Wakisaka, Shinji A1 Ukawa, Ken A1 Fukushima, Takafumi A1 Suganuma, Katsuaki A1 Kurita, Yoichiro YR 2023 SN 2377-5726 K1 Wiring K1 Optical interconnections K1 Bridge circuits K1 Integrated circuit interconnections K1 Computer architecture K1 Materials reliability K1 Reliability engineering K1 Chiplet K1 Integration K1 Bridge K1 RDL K1 Fine Via SP 34 OP 39 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00014 DO https://doi.org/10.1109/ECTC51909.2023.00014 SF ELIB - SuUB Bremen
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