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Investigation of Cu-to-Cu and Oxide-to-Oxide Bonding:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Lee, Sangmin ; Oh, Gwangsik ; Choi, Junyoung... - p. 1519-1523 , 2023
Link: https://doi.org/10.1109/ECTC51909.2023.00258