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Novel low-loss resin coated copper and core material for ad..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Muguruma, Tomo ; Shin, Tom ; Aoki, Keita... - p. 1866-1870 , 2023
Link: https://doi.org/10.1109/ECTC51909.2023.00319