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1 Ergebnisse
1
High Density VR Solutions using Immersion Cooling:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Ruelas Flores, Jesus Gilberto
;
Hernandez, Arturo Sanchez
;
Padilla Ramirez, Ernesto Antonio
... - p. 1739-1743 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00297
RT T1
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
: T1
High Density VR Solutions using Immersion Cooling
UL https://suche.suub.uni-bremen.de/peid=ieee-10195740&Exemplar=1&LAN=DE A1 Ruelas Flores, Jesus Gilberto A1 Hernandez, Arturo Sanchez A1 Padilla Ramirez, Ernesto Antonio A1 del Rio Gonzalez, Oscar A A1 Macias, Andres Ramirez A1 Mora Flores, Carlos E YR 2023 SN 2377-5726 K1 Performance evaluation K1 Data centers K1 Regulators K1 Costs K1 Power demand K1 Immersion cooling K1 Topology K1 Immersion Cooling K1 TLVR K1 Efficiency K1 2PIC SP 1739 OP 1743 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00297 DO https://doi.org/10.1109/ECTC51909.2023.00297 SF ELIB - SuUB Bremen
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