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1 Ergebnisse
1
Low Temperature and Fine Pitch Nanocrystalline Cu/SiCN Wafe..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Chiu, Wei-Lan
;
Lee, Ou-Hsiang
;
Kuo, Tzu-Ying
... - p. 1105-1109 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00189
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Low Temperature and Fine Pitch Nanocrystalline Cu/SiCN Wafer-to-Wafer Hybrid Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195742&Exemplar=1&LAN=DE A1 Chiu, Wei-Lan A1 Lee, Ou-Hsiang A1 Kuo, Tzu-Ying A1 Lo, James Yi-Jen A1 Shih, Chiang-Lin A1 Chiu, Hsih-Yang A1 Chang, Hsiang-Hung YR 2023 SN 2377-5726 K1 Silicon compounds K1 Grain size K1 Electrochemical deposition K1 Semiconductor device reliability K1 Electronic components K1 Bandwidth K1 Packaging K1 nanocrystalline copper K1 3DIC K1 Cu Pad K1 SiCN K1 low- temperature bonding K1 fine pitch wafer to wafer hybrid bonding SP 1105 OP 1109 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00189 DO https://doi.org/10.1109/ECTC51909.2023.00189 SF ELIB - SuUB Bremen
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