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1 Ergebnisse
1
Control of Solder Microstructure Stimulated by Interface Co..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Mohanram, Hariram
;
Kim, Yiram
;
Ni, Geng
... - p. 1060-1065 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00181
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Control of Solder Microstructure Stimulated by Interface Condition of the UBM/Solder and Enhancement of Electromigration Reliability</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195744&Exemplar=1&LAN=DE A1 Mohanram, Hariram A1 Kim, Yiram A1 Ni, Geng A1 Kim, Choong-Un A1 Ankamah-Kusi, Sylvester A1 Chen, Qiao A1 Thompson, Patrick YR 2023 SN 2377-5726 K1 Electromigration K1 Electronic components K1 Lead K1 Surface texture K1 Kinetic theory K1 Reliability K1 Microstructure K1 solder Interconnects K1 electromigration reliability K1 Nickel K1 Sn grain orientation K1 substrate effect SP 1060 OP 1065 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00181 DO https://doi.org/10.1109/ECTC51909.2023.00181 SF ELIB - SuUB Bremen
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