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1 Ergebnisse
1
Advanced Fan-Out Panel Level Package (FO-PLP) Development f..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Kim, Hyungmin
;
Choi, Jaehoon
;
Lee, Seok Won
... - p. 266-270 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00052
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Advanced Fan-Out Panel Level Package (FO-PLP) Development for High-end Mobile Application</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195747&Exemplar=1&LAN=DE A1 Kim, Hyungmin A1 Choi, Jaehoon A1 Lee, Seok Won A1 Cho, Eun Seok A1 Park, Hwanpil A1 Oh, Hwasub A1 Lee, Junho A1 Ha, Seungsoo A1 Choi, Wonkyung A1 Kim, Dong Wook YR 2023 SN 2377-5726 K1 Temperature measurement K1 Thermal expansion K1 Temperature K1 Thermal resistance K1 Electronic packaging thermal management K1 Thermal conductivity K1 Flip-chip devices K1 FO-PLP K1 Thermal performance K1 Reliability SP 266 OP 270 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00052 DO https://doi.org/10.1109/ECTC51909.2023.00052 SF ELIB - SuUB Bremen
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