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Reference Thermal Chips for 2D and 3D Co-packaging Process ..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Gupta, Parnika
;
Bernson, Robert
;
Nudds, Noreen
... - p. 2160-2165 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00372
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Reference Thermal Chips for 2D and 3D Co-packaging Process Development</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195759&Exemplar=1&LAN=DE A1 Gupta, Parnika A1 Bernson, Robert A1 Nudds, Noreen A1 Collins, Sean A1 Gradkowski, Kamil A1 Morrissey, Padraic E. A1 O' Brien, Peter YR 2023 SN 2377-5726 K1 Temperature measurement K1 Couplings K1 Semiconductor device measurement K1 Three-dimensional displays K1 Standardization K1 Packaging K1 Electronic packaging thermal management K1 reference thermal chip K1 reference PIC K1 thermal characterization K1 optical characterization SP 2160 OP 2165 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00372 DO https://doi.org/10.1109/ECTC51909.2023.00372 SF ELIB - SuUB Bremen
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