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1 Ergebnisse
1
A novel and simple method of low temperature, low process t..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Huang, Jeng-Hau
;
Shih, Po-Shao
;
Shen, Chang-Hsien
... - p. 1660-1663 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00282
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A novel and simple method of low temperature, low process time, pressureless interconnection for 3D packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195761&Exemplar=1&LAN=DE A1 Huang, Jeng-Hau A1 Shih, Po-Shao A1 Shen, Chang-Hsien A1 Renganathan, Vengudusamy A1 Grafner, Simon Johannes A1 Lin, Yu-Chun A1 Kao, Chin-Li A1 Lin, Yung-Sheng A1 Hung, Yun-Ching A1 Chiang, Chun-Wei A1 Kao, C.R. YR 2023 SN 2377-5726 K1 Mass production K1 Three-dimensional displays K1 Surface morphology K1 Packaging K1 Plating K1 Surface roughness K1 Copper K1 3D integration K1 Electroless Cu plating K1 Pressure free bonding K1 Low-temperature bonding K1 Electroless Cu plating solution SP 1660 OP 1663 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00282 DO https://doi.org/10.1109/ECTC51909.2023.00282 SF ELIB - SuUB Bremen
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