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Forming of advanced THT-interconnects using SB2 laser solde..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Fettke, Matthias ; Bonow, Gero ; Fisch, Anne... - p. 643-650 , 2023
Link: https://doi.org/10.1109/ECTC51909.2023.00113