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Micro-structure analysis of solder joint using room tempera..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Moon, Yoon Hwan ; Joo, Jiho ; Choi, Gwang-Mun... - p. 01-06 , 2023
Link: https://doi.org/10.1109/ECTC51909.2023.00104