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1
A Continuum Damage Mechanics Approach for the Reliability o..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Mazumder, Golam Rakib
;
Haq, Mohammad Ashraful
;
Suhling, Jeffrey C.
... - p. 713-720 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00124
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A Continuum Damage Mechanics Approach for the Reliability of Lead-Free Solders Subjected to Cyclic Loading</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195782&Exemplar=1&LAN=DE A1 Mazumder, Golam Rakib A1 Haq, Mohammad Ashraful A1 Suhling, Jeffrey C. A1 Lall, Pradeep A1 Chen, Yaxiong A1 Hauck, Torsten A1 Fahim, Abdullah YR 2023 SN 2377-5726 K1 Degradation K1 Vibrations K1 Thermal expansion K1 Creep K1 Environmentally friendly manufacturing techniques K1 Loading K1 Energy dissipation K1 Lead Free Solder K1 SAC Alloy K1 Cyclic Stress-Strain Curve K1 Secondary Creep Rate K1 Cyclic Degradation K1 Hysteresis K1 Microstructure Evolution SP 713 OP 720 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00124 DO https://doi.org/10.1109/ECTC51909.2023.00124 SF ELIB - SuUB Bremen
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