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1 Ergebnisse
1
Effects of High-Temperature Exposure on the Thermo-Mechanic..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Kim, Junmo
;
Song, Myoung
;
Gu, Chang-Yeon
... - p. 1231-1236 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00210
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Effects of High-Temperature Exposure on the Thermo-Mechanical Behavior of Epoxy Molding Compound and Warpage of Molded Wafers</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195784&Exemplar=1&LAN=DE A1 Kim, Junmo A1 Song, Myoung A1 Gu, Chang-Yeon A1 Ju, Min Sang A1 Ma, Sung Woo A1 Lee, Jin Hee A1 Lee, Woong-Sun A1 Kim, Taek-Soo YR 2023 SN 2377-5726 K1 Temperature measurement K1 Thermal expansion K1 Heat treatment K1 Temperature K1 Thermomechanical processes K1 Electromagnetic compatibility K1 Electronic packaging thermal management K1 warpage K1 epoxy molding compound K1 oxidation K1 molded wafer K1 thermo-mechanical behavior SP 1231 OP 1236 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00210 DO https://doi.org/10.1109/ECTC51909.2023.00210 SF ELIB - SuUB Bremen
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