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1 Ergebnisse
1
Metal Additively Microfabricated SiPs with Embedded Microfl..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Lohani, Bhushan
;
Hossain, Sheikh Dobir
;
Roberts, Robert C.
- p. 1622-1626 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00275
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Metal Additively Microfabricated SiPs with Embedded Microfluidic Cooling Towards Heterogeneous Integration with SoCs</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195787&Exemplar=1&LAN=DE A1 Lohani, Bhushan A1 Hossain, Sheikh Dobir A1 Roberts, Robert C. YR 2023 SN 2377-5726 K1 Microchannels K1 Cooling K1 Thermal resistance K1 Thermal management K1 Metals K1 Electronic packaging thermal management K1 Powders K1 heterogeneous integration K1 system-in-package K1 electronic thermal management K1 microfluidic cooling K1 additive microfabrication SP 1622 OP 1626 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00275 DO https://doi.org/10.1109/ECTC51909.2023.00275 SF ELIB - SuUB Bremen
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