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1 Ergebnisse
1
A Thermally Friendly Bonding Scheme for 3D System Integrati..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Kuo, Gordon
;
Chen, Chih-Yuan
;
Hsieh, Cheng-Chieh
... - p. 1973-1976 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00339
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A Thermally Friendly Bonding Scheme for 3D System Integration</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195788&Exemplar=1&LAN=DE A1 Kuo, Gordon A1 Chen, Chih-Yuan A1 Hsieh, Cheng-Chieh A1 Lee, Chung-Ju A1 Wu, Jason A1 Cui, Ji James A1 Kuo, Yen-Liang A1 Tung, Chih-Hang A1 Ku, Terry A1 Tsai, Chung-Hao A1 Yee, Kuo-Chung A1 Yu, Douglas C.H. YR 2023 SN 2377-5726 K1 Three-dimensional displays K1 Planarization K1 Thermal resistance K1 Stacking K1 Metals K1 System integration K1 Energy efficiency K1 thermal enhancement K1 SoIC K1 bonding K1 3D system integration K1 energy efficient SP 1973 OP 1976 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00339 DO https://doi.org/10.1109/ECTC51909.2023.00339 SF ELIB - SuUB Bremen
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