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1 Ergebnisse
1
High Performance, Multilayer Copper-Graphene Micro-Foam Wic..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Moss, Alex
;
Antoniou, Antonia
;
Smet, Vanessa
- p. 2087-2092 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00357
RT T1
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
: T1
High Performance, Multilayer Copper-Graphene Micro-Foam Wicks for Vapor Chambers
UL https://suche.suub.uni-bremen.de/peid=ieee-10195802&Exemplar=1&LAN=DE A1 Moss, Alex A1 Antoniou, Antonia A1 Smet, Vanessa YR 2023 SN 2377-5726 K1 Technological innovation K1 Graphene K1 Thermomechanical processes K1 Heat pipes K1 Nonhomogeneous media K1 Electronic packaging thermal management K1 Copper K1 foam wicks K1 miniaturized vapor chamber K1 multilayer copper-graphene coating K1 advanced heat spreading SP 2087 OP 2092 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00357 DO https://doi.org/10.1109/ECTC51909.2023.00357 SF ELIB - SuUB Bremen
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