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1 Ergebnisse
1
New Methodology Assessment of Copper Trace and Solder Joint..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Khaldarov, Valeriy
;
Zhang, Andy
;
Xie, Dongji
... - p. 412-419 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00075
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>New Methodology Assessment of Copper Trace and Solder Joint Fatigue Failures in Board-level Random Vibrations for Automotive Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195807&Exemplar=1&LAN=DE A1 Khaldarov, Valeriy A1 Zhang, Andy A1 Xie, Dongji A1 Lee, Jeffrey A1 Shi, Xue A1 Roucou, Romuald A1 Doranga, Sushil A1 Jian, Minghong A1 Kelly, Brian A1 Shalumov, Alexander YR 2023 SN 2377-5726 K1 Vibrations K1 Geometry K1 Printed circuits K1 Failure analysis K1 Predictive models K1 Fatigue K1 Mathematical models K1 JEDEC K1 random vibration K1 printed circuit board assembly K1 SAC305 solder joints K1 copper traces K1 high-cycle fatigue K1 Garofalo hyperbolic sine function SP 412 OP 419 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00075 DO https://doi.org/10.1109/ECTC51909.2023.00075 SF ELIB - SuUB Bremen
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