I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Study of Fabrication and Reliability for the extremely larg..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Murai, Kosuke
;
Onozeki, Hitoshi
;
Kang, Dongchul
.. - p. 899-906 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00155
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Study of Fabrication and Reliability for the extremely large 2.5D advanced Package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195815&Exemplar=1&LAN=DE A1 Murai, Kosuke A1 Onozeki, Hitoshi A1 Kang, Dongchul A1 Hirano, Kazue A1 Mitsukura, Kazuyki YR 2023 SN 2377-5726 K1 Fabrication K1 Thermal expansion K1 TV K1 Routing K1 Reliability engineering K1 Electronic packaging thermal management K1 Silicon K1 2.5D advanced package K1 silicon interposer K1 CUF K1 MUF K1 reliability test K1 organic substrate K1 warpage K1 assembly process SP 899 OP 906 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00155 DO https://doi.org/10.1109/ECTC51909.2023.00155 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)
