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1 Ergebnisse
1
Study of Fabrication and Reliability for the extremely larg..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Murai, Kosuke
;
Onozeki, Hitoshi
;
Kang, Dongchul
.. - p. 899-906 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00155
RT T1
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
: T1
Study of Fabrication and Reliability for the extremely large 2.5D advanced Package
UL https://suche.suub.uni-bremen.de/peid=ieee-10195815&Exemplar=1&LAN=DE A1 Murai, Kosuke A1 Onozeki, Hitoshi A1 Kang, Dongchul A1 Hirano, Kazue A1 Mitsukura, Kazuyki YR 2023 SN 2377-5726 K1 Fabrication K1 Thermal expansion K1 TV K1 Routing K1 Reliability engineering K1 Electronic packaging thermal management K1 Silicon K1 2.5D advanced package K1 silicon interposer K1 CUF K1 MUF K1 reliability test K1 organic substrate K1 warpage K1 assembly process SP 899 OP 906 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00155 DO https://doi.org/10.1109/ECTC51909.2023.00155 SF ELIB - SuUB Bremen
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