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1 Ergebnisse
1
A Quantitative Evaluation of the Inelastic Energy Absorptio..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Wang, Chien-Yu
;
Chiu, Tz-Cheng
;
Yin, Wei-Jie
... - p. 721-726 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00125
RT T1 <cTitle>2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A Quantitative Evaluation of the Inelastic Energy Absorptions in Cu-Polyimide Interconnect and the Effect on Interface Debond Driving Force</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10195818&Exemplar=1&LAN=DE A1 Wang, Chien-Yu A1 Chiu, Tz-Cheng A1 Yin, Wei-Jie A1 Chen, Dao-Long A1 Chen, Tang-Yuan A1 Kao, Chin-Li YR 2023 SN 2377-5726 K1 Damping K1 Deformation K1 Absorption K1 Energy dissipation K1 Force K1 Loading K1 Thermal force K1 viscoelastic K1 viscoplastic K1 energy rate K1 dissipation K1 crack K1 redistribution SP 721 OP 726 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00125 DO https://doi.org/10.1109/ECTC51909.2023.00125 SF ELIB - SuUB Bremen
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