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1 Ergebnisse
1
Chip level evaluation of wafer-to-wafer direct bonding stre..:
, In:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
,
Baek, Kyungmin
;
Kim, Juno
;
Han, Min-soo
.. - p. 310-317 , 2023
Link:
https://doi.org/10.1109/ECTC51909.2023.00059
RT T1
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
: T1
Chip level evaluation of wafer-to-wafer direct bonding strength with bending test
UL https://suche.suub.uni-bremen.de/peid=ieee-10195819&Exemplar=1&LAN=DE A1 Baek, Kyungmin A1 Kim, Juno A1 Han, Min-soo A1 Lim, Kyeongbin A1 Rhee, Daniel Minwoo YR 2023 SN 2377-5726 K1 Semiconductor device modeling K1 Solid modeling K1 Semiconductor device measurement K1 Analytical models K1 Three-dimensional displays K1 Semiconductor device reliability K1 Bending K1 3D Heterogeneous integration K1 Hybrid bonding K1 W2W bonding K1 Bonding strength characterization K1 Bending test K1 Finite element analysis SP 310 OP 317 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51909.2023.00059 DO https://doi.org/10.1109/ECTC51909.2023.00059 SF ELIB - SuUB Bremen
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