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Chip level evaluation of wafer-to-wafer direct bonding stre..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Baek, Kyungmin ; Kim, Juno ; Han, Min-soo.. - p. 310-317 , 2023
Link: https://doi.org/10.1109/ECTC51909.2023.00059