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Flip Chip Process Enablement in IC Memory Stacked Die Packa..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Huang, Chen-Yu ; Chiang, Tsung-Han ; Lee, Jungbae... - p. 283-288 , 2023
Link: https://doi.org/10.1109/ECTC51909.2023.00055