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1 Ergebnisse
1
Numerical Simulation on Copper Vapor Behavior in Vacuum Arc..:
, In:
2023 30th International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV)
,
Kasui, Daisuke
;
Nakano, Yusuke
;
Tanaka, Yasunori
... - p. 221-224 , 2023
Link:
https://doi.org/10.23919/ISDEIV55268.2023.10199313
RT T1 <cTitle>2023 30th International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV)</cTitle>: T1 <Title>Numerical Simulation on Copper Vapor Behavior in Vacuum Arcs during Low-Current and Current Decaying Process using Moving Particle Method</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10199313&Exemplar=1&LAN=DE A1 Kasui, Daisuke A1 Nakano, Yusuke A1 Tanaka, Yasunori A1 Ishijima, Tatsuo A1 Asanuma, Gaku A1 Yamamoto, Shinji A1 Onchi, Toshiyuki YR 2023 SN 2471-786X K1 Solid modeling K1 Insulation K1 Numerical simulation K1 Discharges (electric) K1 Behavioral sciences K1 Numerical models K1 Vacuum arcs K1 Vacuum circuit breaker K1 Vacuum arc K1 Decay process K1 MPS method SP 221 OP 224 LK http://dx.doi.org/https://doi.org/10.23919/ISDEIV55268.2023.10199313 DO https://doi.org/10.23919/ISDEIV55268.2023.10199313 SF ELIB - SuUB Bremen
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