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1 Ergebnisse
1
Analysis of Breakdown Endurance Performance under Coupling ..:
, In:
2023 30th International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV)
,
Hongfei, Shi
;
Xiaoming, Liu
;
Hai, Chen
... - p. 465-468 , 2023
Link:
https://doi.org/10.23919/ISDEIV55268.2023.10201146
RT T1 <cTitle>2023 30th International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV)</cTitle>: T1 <Title>Analysis of Breakdown Endurance Performance under Coupling Effect of Current Drop Rate and Voltage Rise Rate for DC Vacuum Circuit Breaker</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10201146&Exemplar=1&LAN=DE A1 Hongfei, Shi A1 Xiaoming, Liu A1 Hai, Chen A1 Peiyuan, Li A1 Yongjie, Zhou A1 Xu, Han YR 2023 SN 2471-786X K1 Couplings K1 Breakdown voltage K1 Insulation K1 Electric breakdown K1 Circuit breakers K1 Mathematical models K1 Integrated circuit reliability K1 DC Vacuum circuit breaker K1 dielectric recovery K1 post-arc sheath K1 current drop rate K1 voltage rise rate SP 465 OP 468 LK http://dx.doi.org/https://doi.org/10.23919/ISDEIV55268.2023.10201146 DO https://doi.org/10.23919/ISDEIV55268.2023.10201146 SF ELIB - SuUB Bremen
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