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1 Ergebnisse
1
A Deep Learning-based Microsection Measurement Framework fo..:
, In:
2023 IEEE International Conference on Industry 4.0, Artificial Intelligence, and Communications Technology (IAICT)
,
Lin, Chia-Yu
;
Li, Chieh-Ling
;
Kuo, Yu-Chiao
... - p. 291-294 , 2023
Link:
https://doi.org/10.1109/IAICT59002.2023.10205911
RT T1 <cTitle>2023 IEEE International Conference on Industry 4.0, Artificial Intelligence, and Communications Technology (IAICT)</cTitle>: T1 <Title>A Deep Learning-based Microsection Measurement Framework for Print Circuit Boards</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10205911&Exemplar=1&LAN=DE A1 Lin, Chia-Yu A1 Li, Chieh-Ling A1 Kuo, Yu-Chiao A1 Cheng, Yun-Chieh A1 Jian, Cheng-Yuan A1 Huang, Hsiang-Ting A1 Hsu, Mitchel M. YR 2023 SN 2834-8249 K1 Adaptation models K1 Printed circuits K1 Area measurement K1 Object detection K1 Predictive models K1 Labeling K1 Noise measurement K1 Microsection measurement K1 print circuit boards K1 deep learning SP 291 OP 294 LK http://dx.doi.org/https://doi.org/10.1109/IAICT59002.2023.10205911 DO https://doi.org/10.1109/IAICT59002.2023.10205911 SF ELIB - SuUB Bremen
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