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1 Ergebnisse
1
Embedded Microchannel Cooling for the System on Wafer Packa..:
, In:
2023 6th International Conference on Electronics Technology (ICET)
,
Li, Jie
;
Liu, Guandong
;
Wang, Chuanzhi
... - p. 411-415 , 2023
Link:
https://doi.org/10.1109/ICET58434.2023.10211360
RT T1 <cTitle>2023 6th International Conference on Electronics Technology (ICET)</cTitle>: T1 <Title>Embedded Microchannel Cooling for the System on Wafer Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10211360&Exemplar=1&LAN=DE A1 Li, Jie A1 Liu, Guandong A1 Wang, Chuanzhi A1 Wang, Weihao A1 Cao, Rong A1 Liu, Lingling YR 2023 SN 2768-6515 K1 Manifolds K1 Spirals K1 Manufacturing processes K1 Thermal resistance K1 Simulation K1 Packaging K1 Electronic packaging thermal management K1 SoW K1 microchannel K1 heat sink SP 411 OP 415 LK http://dx.doi.org/https://doi.org/10.1109/ICET58434.2023.10211360 DO https://doi.org/10.1109/ICET58434.2023.10211360 SF ELIB - SuUB Bremen
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