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1 Ergebnisse
1
Research on the Effects of Solder Layer THICKNESS on the Re..:
, In:
2023 6th International Conference on Electronics Technology (ICET)
,
Wu, Lei
;
Yang, Yuan
;
Yang, Xiaofei
... - p. 965-969 , 2023
Link:
https://doi.org/10.1109/ICET58434.2023.10211457
RT T1 <cTitle>2023 6th International Conference on Electronics Technology (ICET)</cTitle>: T1 <Title>Research on the Effects of Solder Layer THICKNESS on the Reliability of High Power IGBT Module</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10211457&Exemplar=1&LAN=DE A1 Wu, Lei A1 Yang, Yuan A1 Yang, Xiaofei A1 Ma, Haohao A1 Gong, Hao A1 Hou, Shuyue YR 2023 SN 2768-6515 K1 Insulated gate bipolar transistors K1 Temperature distribution K1 Thermal expansion K1 Thermal resistance K1 Reliability K1 Soldering K1 Stress K1 IGBT K1 solder thickness K1 solder layer thickness K1 void K1 reliability SP 965 OP 969 LK http://dx.doi.org/https://doi.org/10.1109/ICET58434.2023.10211457 DO https://doi.org/10.1109/ICET58434.2023.10211457 SF ELIB - SuUB Bremen
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