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1 Ergebnisse
1
A L-Band High Gain Amplifier Module Using 3D SiP Technology:
, In:
2023 6th International Conference on Electronics Technology (ICET)
,
Su, Jiaqi
;
Li, Bin
;
Yao, Xin
... - p. 324-328 , 2023
Link:
https://doi.org/10.1109/ICET58434.2023.10211962
RT T1 <cTitle>2023 6th International Conference on Electronics Technology (ICET)</cTitle>: T1 <Title>A L-Band High Gain Amplifier Module Using 3D SiP Technology</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10211962&Exemplar=1&LAN=DE A1 Su, Jiaqi A1 Li, Bin A1 Yao, Xin A1 Zhao, Bochao A1 Ren, Fengchao A1 Zhang, Hengshuang A1 Wang, Xiaoli YR 2023 SN 2768-6515 K1 Noise figure K1 Low-noise amplifiers K1 Three-dimensional displays K1 System-in-package K1 Stability analysis K1 Circuit stability K1 Gain K1 system in package (SiP) K1 silicon interposer K1 high integration K1 miniaturization SP 324 OP 328 LK http://dx.doi.org/https://doi.org/10.1109/ICET58434.2023.10211962 DO https://doi.org/10.1109/ICET58434.2023.10211962 SF ELIB - SuUB Bremen
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