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1 Ergebnisse
1
Loop Height Effects on Bond Wire Reliability under Power cy..:
, In:
2023 11th International Conference on Power Electronics and ECCE Asia (ICPE 2023 - ECCE Asia)
,
Xiang, Enyao
;
Luo, Haoze
;
Yang, Huan
... - p. 902-908 , 2023
Link:
https://doi.org/10.23919/ICPE2023-ECCEAsia54778.2023.1..
RT T1 <cTitle>2023 11th International Conference on Power Electronics and ECCE Asia (ICPE 2023 - ECCE Asia)</cTitle>: T1 <Title>Loop Height Effects on Bond Wire Reliability under Power cycling for SiC Power Module</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10213537&Exemplar=1&LAN=DE A1 Xiang, Enyao A1 Luo, Haoze A1 Yang, Huan A1 He, Xiangning A1 Fujishima, Naoto A1 Nishio, Haruhiko A1 Sumida, Hitoshi YR 2023 SN 2150-6086 K1 Correlation K1 Deformation K1 Simulation K1 Wires K1 Thermomechanical processes K1 Multichip modules K1 Finite element analysis K1 Power Module K1 Bonding wire K1 Loop Height K1 Reliability SP 902 OP 908 LK http://dx.doi.org/https://doi.org/10.23919/ICPE2023-ECCEAsia54778.2023.10213537 DO https://doi.org/10.23919/ICPE2023-ECCEAsia54778.2023.10213537 SF ELIB - SuUB Bremen
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