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1 Ergebnisse
1
Verification of Hygrothermal Simulations Using Silicone Enc..:
, In:
2023 11th International Conference on Power Electronics and ECCE Asia (ICPE 2023 - ECCE Asia)
,
Frohling, Soren
;
Kostka, Benedikt
;
Wenzel, Johannes C.
... - p. 1361-1369 , 2023
Link:
https://doi.org/10.23919/ICPE2023-ECCEAsia54778.2023.1..
RT T1 <cTitle>2023 11th International Conference on Power Electronics and ECCE Asia (ICPE 2023 - ECCE Asia)</cTitle>: T1 <Title>Verification of Hygrothermal Simulations Using Silicone Encapsulated Climate Sensors in Continuously Operated IGBT Power Modules</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10213687&Exemplar=1&LAN=DE A1 Frohling, Soren A1 Kostka, Benedikt A1 Wenzel, Johannes C. A1 Fischer, Katharina A1 Peters, Jan-Hendrik A1 Hanf, Michael A1 Zorn, Christian A1 Dehning, Kirsten A1 Zimmermann, Stefan A1 Kaminski, Nando A1 Mertens, Axel YR 2023 SN 2150-6086 K1 Temperature measurement K1 Insulated gate bipolar transistors K1 Semiconductor device measurement K1 Power measurement K1 Pulse measurements K1 Asia K1 Multichip modules K1 Degradation K1 IGBT K1 Reliability K1 Silicone gel SP 1361 OP 1369 LK http://dx.doi.org/https://doi.org/10.23919/ICPE2023-ECCEAsia54778.2023.10213687 DO https://doi.org/10.23919/ICPE2023-ECCEAsia54778.2023.10213687 SF ELIB - SuUB Bremen
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